Semiconductor IP Design
NexaSilicon Co., Ltd. is a semiconductor IP design specialist based in Seongnam, Gyeonggi-do, South Korea. Founded in April 2026, we bring together a design team with a long track record of mass-production chips across mobile, IoT, automotive, medical, and security applications — now organized as a focused, independent IP design house.
What we do
Business scope (per our articles of incorporation): semiconductor IC manufacturing and design, semiconductor layout, design services, IP development, software development and supply, semiconductor sales and distribution, technology licensing, and related consulting and R&D services.
Specification definition and system architecture, tailored to each customer's application requirements.
RTL coding and integration, with RTL-level, gate-level, and post-layout verification using UVM environments and test-vector generation. This is where most schedule risk on a SoC program actually lives, so it gets our deepest bench strength.
Logic synthesis, STA, formal & CDC checks, floorplanning, CTS, place & routing, and DRC/LVS.
Software and hardware development kits — firmware, boot code, and device drivers, built alongside the hardware.
Gate-level simulation through to chip test, validating silicon against the original specification.
Ongoing support through ramp and mass production, carrying design intent through to volume manufacturing.
We build complete SoC platforms around embedded cores (ARM, RISC-V, 8051), with custom bus architectures (AHB, AXI) sized to each customer's requirements.
Our verification approach combines UVM environments with C-code system tests, covering functional coverage, code coverage, and performance validation — backed by hardware modeling and firmware/device-driver development at the system level.
NexaSilicon has developed a broad library of self-owned IP spanning CPU cores, bus systems, memory controllers, peripherals, and application-specific hardware engines — giving customers a ready foundation to accelerate SoC development and reduce third-party licensing costs.
Our design team has taken more than 10 chips into mass production across mobile, IoT, security, and automotive applications, working with leading foundries in Korea, China, and Japan.
The below experience represents the prior professional experience of our team members and does not imply ownership of the products, technologies, or intellectual property developed at their previous employers.
| Application | Process / Foundry | Core Processor | Bus | Highlight |
|---|---|---|---|---|
| PMIC MCU | SMIC 180nm | Cortex-M0 | MLAHB | 4-channel DC-DC power converter integrated with MCU |
| Voice recognition | SMIC 130nm | NX8051 (proprietary) | AMBA | Sound QR + VRE voice-recognition engine |
| Audio amplifier | SMIC 130nm | Tensilica DSP | 64-bit AHB | Audio DSP design service |
| Content security | Samsung 130nm | Cortex-M3 + DSP | MLAHB | DRM / security chip |
| Home appliance MCU | SMIC 180nm | Cortex-M3 | MLAHB | Home appliance MCU |
| Navigation | Fujitsu 65nm | ARM1176 | AXI (PL301) | High-spec navigation SoC |
| Ultrasonic sensor | SMIC 180nm | SiFive E21 | MLAHB | RISC-V-based sensor SoC |
| Blood glucose sensor | Samsung LF6 | SiFive E24 | MLAHB | Always-On low-power architecture |
| Card reader | Platform | Tensilica DSP | MLAHB | NFC / RFID application |
| Card reader | Magnachip 180nm | Cortus CPU | MLAHB | Security authentication chip |
Ultra-low-power MCU platforms on Cortex-M or RISC-V, smart appliance controllers, sensor-fusion SoCs, wireless communication modules.
Audio DSP, MP3/media processing, touch, and camera auto-focus solutions across a wide range of consumer products.
Content-protection, SIM, and OTP solutions; battery authentication security chips.
Ultrasonic sensors and blood-glucose monitoring built on a low-power Always-On architecture.
CAN/LIN communication, navigation, and motor-control designs built for high reliability.
Hardware-accelerated MFCC processing and a compact voice-recognition engine for small-footprint AI inference platforms.
License our proprietary IP modules per project or per volume.
Full RTL-to-GDSII design flow delivered on your behalf.
Collaborative R&D and technology co-development.
Advisory support on semiconductor design, measurement, and application engineering.
More than 10 chips in mass production across mobile, IoT, automotive, and medical applications, demonstrating full-flow design capability.
40+ proprietary IP modules spanning CPU cores to bus, peripheral, and codec blocks, shortening development cycles and reducing third-party licensing costs.
Real tape-out experience from 65nm to 180nm across SMIC, Samsung, Magnachip, and Fujitsu.
IP licensing, design services, and joint development, tailored to each customer's needs.
A focused, senior team with quick decision-making, backed by an in-house toolchain and verification platform.
Deep understanding of the Korean semiconductor ecosystem, combined with experience serving China, Japan, and other Asian markets.
We welcome inquiries about IP licensing, design services, and joint development.
cymo1002@nexasilicon.com
